Over the past few years, chip giant Intel has struggled to do what it historically did best: manufacturing the world’s most advanced chips. It has faced difficulties shrinking its chips down to the 10 nanometer density. Now, rather than just focusing on shrinking chips down to smaller dimensions, it is also looking to stack chips on top of each other to make its chips faster and more energy efficient.
Intel is calling this three-dimensional chip approach Foveros. Memory chips have already adopted this 3D packaging technique to boost their performance in recent years. As Intel loses its manufacturing edge, radical ideas such as this could help it keep up. SkyWater, a new Minnesota-based chip fabrication facility with money from DARPA, is also trying to build 3D chips.