TSMC Develops AI Chip Packaging Tech to Counter Intel

Taiwan Semiconductor Manufacturing Co. is developing an advanced chip-packaging technology similar to what Intel already offers, according to two people with direct knowledge of the project, a sign that the world’s leading chip manufacturer is worried about competition from a distant rival. Chip packaging is the final stage of chip production, where separate pieces of silicon are assembled into a single unit and wired together so they can work as one and connect to the rest of a computer....